under the demand of electronic products towards thinness, smallness, rapidity, high functionality and high frequency, the calorific value is getting higher and higher.with the development and use of microprocessors above 3GHz, the calorific value is more than 80W, which makes the heat dissipation of computers a difficult problem.among them, workers

at present, most of the radiating fins are made of aluminum and copper.although the thermal conductivity of copper material is better than that of aluminum, the copper material has a significant ratio, high hardness and melting point, high price and is not easy to produce in large quantities, so the market share is only 5%, but the heat dissipation rate of the radiating fins made of aluminum material is similar to

in the operation process of electronic components or devices, heat will inevitably be generated.in order to eliminate heat, heat must be discharged to the surrounding environment by conduction, convection and radiation to reduce the operating temperature of electronic products to maintain the stability and reliability of system operation.electronic group soaking, so that heat can be rapidly conducted and diffused.the function of the fin part is to dissipate heat.the heat diffused through the bottom plate is transferred by the increase of surface area, and the heat is dissipated from the surface of the fin to the surrounding environment by air convection.when the surface area of the fin is larger, the better the heat dissipation effect is, and the better make electronic components to achieve the desired efficiency, the more energy-saving effect. In order to enhance the heat dissipation effect of the fins, the above-mentioned fins are mostly equipped with a fan to increase the convection of air, but one-as mentioned earlier, industrial computers are thinner, lighter and shorter in size, and are more suitable for systems stability requirements are extremely high.fan-free design has great benefits in increasing system stability (fan life is only two years), low noise, dust prevention and other demands.therefore, the heat dissipation problem of industrial computers is an urgent issue that needs urgent improvement.

the main purpose of this paper is to provide a fan-free industrial computer structure with simple structure and good heat dissipation of combined aluminum fin heat dissipation shell.using its good heat dissipation module, it can be used in light, thin and short industrial computers.

in order to achieve the above-mentioned purpose, the computer casing itself is a radiator.the structure of this paper includes a heat conducting block, a motherboard and a plurality of radiating fins.the radiating fins are made of aluminum material after preheating, and are made of extrusion die, with the surface extending outward into a plurality of fins. The heat sink is composed of the sliding chute and the sliding rail are embedded into each other-"the inside of the j-shaped heat dissipation shell is in contact with the end of the heat conduction block, and the other end of the heat conduction block is in contact with the heating electronic components on the motherboard, such as a microprocessor, etc.

the function of the heat conduction block is to equalize heat, so that the heat energy generated by the electronic components can be quickly conducted to the heat dissipation shell.the heat conduction block is designed by fins of the heat dissipation shell and dissipates the heat energy to the outside through the heat conduction effect of air.

this article enables manufacturers to produce relatively small-sized extrusion dies with relatively low cost, produce relatively small-sized heat sinks, and then assemble them into relatively large aluminum fin heat dissipation shells by means of combination. In this way, in addition to effectively reducing costs and improving productivity, it also improves industrial power the original purpose of brain heat dissipation problem.