the method relates to a PC desktop computer system and a quasi-system and relates to a new heat dissipation method for the system.

PC desktop computer system and quasi-system (for the definition of quasi-system see "computer application digest" domestic serial number:CN50-1070/TP international serial number:ISSN 1002-1353, 2004 No.13 P116~118) are collectively referred to as computers in the following instructions.

at present, the computer's heat dissipation method:heat radiator (fins made of aluminum or other materials) and fan's forced cooling method are used on the GPU of CPU and video card to transfer heat to the air in the computer chassis, and then the hot air in the chassis and the hot air generated by the power supply are generated by the power supply fan heat is discharged out of the chassis through the power supply vent. The heat dissipation process is shown in Figure 1. This method is characterized by the use of fans and at least two fans:one CPU fan and one power supply fan. Some graphics cards also need fans. However, the installation environment inside the chassis is ultimately limited calm heat dissipation of heating source. However, increasing the speed of the fan and accelerating the air circulation speed will increase the noise, affect the service life of the fan and increase the maintenance frequency.

in a word, the mechanical structure of the fan used in the computer is much shorter than that of other electronic components in the computer.at the same time, it will increase the burden of the power supply, and the noise generated by the fan is very annoying.

the invention is a heat dissipation method which not only can effectively dissipate heat, but also has no noise, no power consumption, long maintenance period and no fan. See the heat dissipation flow chart of fig.2.

radiator a in fig.2, i.e.as shown in fig.3(12). One or more side surfaces of the chassis are formed by a radiator a. In this way, the heat generated inside the computer can naturally dissipate heat through the chassis shell radiator A.. At the same time, it is an integral part of the chassis, and its shape can be fin, flat or any other shape, and can be decorated.

this heat dissipation method can be technically realized as follows:

I CPU

the CPU on the motherboard and heat sink a are in close contact on one side of the chassis to achieve the purpose of direct heat dissipation. Using this method requires changes in the design of the motherboard. The current motherboard design basically puts all components on one side of the motherboard, while the new apply heat-conducting grease between the contact surfaces to improve the heat-conducting effect between the two surfaces.the following is the same. This method has the best heat dissipation effect. The specific implementation can be fastened with screws, or locked with snap locks or other methods.

another way, do not change the existing design of the motherboard, but so that the CPU and radiator a have a distance, can't contact directly. Solution:the distance between CPU and radiator a is connected by heat pipe, which conducts the heat generated by CPU to radiator a, as shown in fig.6 , figure 7. This method does not need to redesign the main board, and heat pipe heat conduction is a mature technology and easy to implement.

ii.video card

the cooling method of the graphics card (except the integrated graphics card integrated on the motherboard and the graphics card with little heat generation) is the same as the second method of the motherboard CPU, as shown in fig.5. One end of the heat pipe is connected with the GPU of the video card, and the other end is connected with the radiator A to solve the problem. (not some video cards heat pipe and small heat sink are directly fixed on the video card. ) The heat pipe heat dissipation method solves the problem of heat dissipation for GPU design with higher performance in the future.

3.power

the power supply is an independent body enclosed by a shell. The fan in the power supply is for heat dissipation of the power supply itself, and another important function is to make forced convection between the hot air in the whole cabinet and the air outside the cabinet. Now, the heat dissipation of CPU and GPU is solved, and the air temperature is not high, there is no need for forced convection by the power supply fan, but natural convection of air inside and outside the cabinet is ok. Then the heat dissipation problem of the heating element in the power supply is solved, and the power supply fan is not needed.

to solve the problem of heat dissipation of the power heating element, one side of the power housing, i.e.one side of the power box as shown in fig.8 (15), with the inside of the box being side b, is tightly attached to the heating element:the outside of the box is side c and the radiator a are tightly attached in the box. This side of the power box is aluminum or other materials with good thermal conductivity. The heating elements in the power box are moved to the side close to the B side by rearranging the circuit boards, so that heat can be dissipated through the way from the C side of the power box to the radiator A. Another method:the circuit board may not be rearranged. the original heat dissipation method is changed to heat pipe heat conduction or other heat conduction methods to conduct the heat of the heating element to the side of the b side of the power box. This method is simpler than the previous method.

it should be noted that mica insulation should be used between the power adjustment tube and side b. So as to ensure reliable insulation from commercial power and good thermal conductivity.