this article relates to a computer cooling fan positioning device, in particular to a positioning device which can adjust the cooling fan according to the position of the CPU on the computer substrate and enable the computer system to obtain the best cooling and ventilation effects.

heat dissipation and ventilation is one of the most important problems in the computer system, especially for the heating electronic components on the computer substrate, such as the heat generated by the central processing unit, if not timely and properly excluded, will inevitably affect the overall function of the computer. In the past, the solution to the heat dissipation problem of the department is to increase the air convection in the computer casing to achieve the purpose of heat dissipation, which can be roughly divided into the following two categories:

1.passive convection heat dissipation, Heat Sink is generally installed in the CPU.the fan of the power supply in the computer system drives the air flow in the computer casing and cooperates with the ventilation holes at appropriate positions on the computer casing to cause air convection inside and outside the casing , take away the heat generated by the central processing unit.

2.active convection heat dissipation:a heat dissipation fan is directly added to the central processing unit equipped with heat dissipation fins to force air convection to concentrate directly above the central processing unit, thereby discharging heat generated by the central processing unit.

for the whole computer system, the passive convection is obviously not as good as the active convection. However, the active convection heat dissipation only concentrates the air convection on the CPU, and the heat dissipation effect on other heat sources inside the computer is not necessarily better than that of the passive pair flow heat dissipation effect is good. At the same time, the active convection heat dissipation must be equipped with a fan with a smaller size.the working efficiency of the heat dissipation fan is often affected by the temperature of the central processing unit, which may lead to instability or even shorten the service life of the fan, thus affecting the center the operating characteristics of the manager. Moreover, the smaller the size of the heat dissipation fan, the higher the difficulty and precision requirements for its manufacture, and at the same time, the influence of temperature on it must be reduced.Therefore, the cost is obviously much higher than that of passive convection heat dissipation devices.

whether it is passive convection heat dissipation or active convection heat dissipation, when the computer casing is inserted with expansion cards and other cable devices, the air circulation in the computer casing is not smooth, thus affecting its heat dissipation effect. If a cooling fan , increasing air convection in the casing, whether the CPU uses active convection or passive convection, will increase the heat dissipation efficiency of the computer system. However, on different computer substrates with the same specifications, the positions of the central processing units are not completely the same, the enhanced heat dissipation airflow cannot determine the position of the CPU configured through each different computer substrate to achieve the best heat dissipation effect. Therefore, the problem of CPU heat dissipation is still unable to get the best solution.

from the above, it can be seen that in the prior art, whether it is active passive convection heat dissipation or installing a fan on the computer casing, there are certain problems in heat dissipation in the computer casing and improvement is urgently needed. The above related prior art can be referred to U.S.pat.No.4,712,159 , 4, 890, 196, 5, 208, 731, 5, 276, 585, 5, 486, 980, 5, 502, 619, etc.

the purpose of this paper is to provide a computer cooling fan positioning device, which can fix the cooling fan at a position where air can generate proper convection, so that the heating electronic components of the computer substrate, such as the central processing unit, can obtain the best cooling effect.

another object of this paper is to provide a computer cooling fan positioning device, which can introduce air from the outside of the computer housing, so that the air can be directly sent to the top of the electronic components to achieve better cooling effect.

install computer cooling fan assembly; The computer and casing are provided with at least a through hole at the periphery of the part where the computer heat dissipation fan positioning device is installed, and the computer fan assembly can introduce cooling air into the casing through the through hole to enable air to flow through the electronics components to achieve the effect of heat dissipation.

the main feature of this paper is that the cooling fan is installed on the computer case.it can introduce the air outside the computer case and strengthen the air convection inside the computer case.it can also change the position of the cooling fan in coordination with the position of the CPU on the computer substrate to make the air convection set in the central processing unit, thus causing the central processing unit to obtain the best heat dissipation effect. It mainly includes:a fan base for installing a computer cooling fan; The bracket comprises a fixing frame (first part) and a fan fixing frame (second part), wherein the fixing frame is fixedly arranged on an electric a skull body, the heat dissipation fan fixing frame is used for installing a fan seat, and the position of the fan seat can be adjusted according to different configurations of a computer substrate.

the advantages of the device in this paper are that it can adjust the installation position of the fan according to the configuration of the computer substrate, thus achieving the best effect of heat dissipation, and it is convenient to install and disassemble, so as to facilitate the disassembly and assembly of the fan.