With the rapid development of chip integration technology, the number of transistors per unit area is constantly increasing, while the performance of the chip is rapidly improving, the heat generation of the chip is also increasing, especially in hot summer, the problem of heat dissipation has become a headache for every computer user, although at present there are many products for air-cooled radiators, but metal fins and fans are generally integrated.this design has the following disadvantages:

1.The air flow is short and the air cannot be guaranteed to flow from the bottom to the top of the radiator.Since the heat is mainly concentrated at the bottom of the radiator, the heat taken away is mainly at the top of the radiator, i.e.near the fan.

2.The heat accumulation effect is caused by the fact that the hot air held out is not directly discharged from the chassis, and the heat is accumulated more and more together with other heating accessories ( such as video cards, hard disks, etc.). These are the reasons why the cooling efficiency of the computer air-cooled radiator is not high.

3.There will be a phenomenon of wind force rebound, and the hot air drawn from the fan may be sucked back into the heat sink to start another cycle.

In order to overcome the shortcomings of the existing air-cooled radiator , a radiator system is designed, which can significantly improve the air-cooled heat dissipation effect. Solution:separate the metal radiator from the fan, install the fan on the chassis, and connect it with the metal radiator through pipes so that cold air can flow from the bottom of the radiator into the cooling, through pipes and fans directly out of the chassis, so as to achieve the purpose of improving heat dissipation efficiency. In this way, the problems of wind force rebound, short flow air stroke of the radiator and heat accumulation effect of the chassis can be avoided, the heat dissipation efficiency is high, and the structure is simple.